Beyond lithography: Chinese chip toolmaker achieves wafer polishing breakthrough

Chinese chip-tool developers continue to make technical progress, with the latest breakthrough in wafer polishing – a critical manufacturing step that flattens and smooths silicon discs – even as the industry remains heavily dependent on foreign suppliers for more complex manufacturing procedures.

This is a short excerpt. EkJhalak links out rather than reproducing other newsrooms’ work — continue at South China Morning Post.